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QFP
(Quad Flat Package) usually has a lot of pins like 48 pins with
0.5mm spacing, which makes it hard for beginners to place it
without risks. However the package is used in many industrial
purposes.
You may well be just soldering DIP (Dual Inline Package)
with 2.54mm pitch, but you can do the same for
SOIC
(Small Outline IC or SO) with 1.27mm pitch
and start getting confidence in fine placing technique
and pursuing soldering technology.
Paste flux on the part where contacts are placed in a row
on the board. You may use paintbrush to make this an easy task.
Flux brushes are like this:
Solder Flux Brush
.
First paste flux on the board where you will solder.
Make the solder run over all the contacts on the board, but without connecting any two of them. Keep the clump flat and reduce the solder that's wasted.
Precisely position the chip on the pattern. Use a pair of tweezers to place it in a way it's close fit to the pins.
Melt the solder at one of the pins right at the corner so that it is immobile by some chance.
Never try putting solder on the pin, or between the pins, Use only the solder existing on the land and let it flow until it touches the pin.
You will break a pin or the pattern. Repeat the steps so you can practice more.
Another way exists...